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新型电力电子器件在高效电机驱动中的应用

摘    要
随着工业4.0时代的到来,高效电机驱动系统在智能制造和节能减排领域的重要性日益凸显。本研究针对传统电力电子器件在电机驱动应用中存在的效率瓶颈和可靠性问题,提出了一种基于宽禁带半导体材料的新型电力电子器件解决方案。通过采用碳化硅和氮化镓等第三代半导体材料,结合创新的器件结构和封装技术,显著提升了器件的开关频率和功率密度。研究采用理论分析、仿真建模和实验验证相结合的方法,重点考察了新型器件在不同工况下的动态特性和热管理性能。实验结果表明,与传统硅基器件相比,新型电力电子器件的开关损耗降低了40%,系统整体效率提升了5-8%。同时,通过优化驱动电路设计和电磁兼容性处理,有效解决了高频开关带来的电磁干扰问题。

关键词:宽禁带半导体  电机驱动系统  电力电子器件


Abstract 
With the advent of industry 4.0 era, the importance of efficient motor drive system in the field of intelligent manufacturing and energy saving and emission reduction is becoming increasingly prominent. This paper presents a new solution based on wide band semiconductor materials for the efficiency bottleneck and reliability problems in motor drive applications. By adopting third-generation semiconductor materials such as silicon carbide and gallium nitride, combined with innovative device structure and packaging technology, the switching frequency and power density of the device have been significantly improved. The combination of theoretical analysis, simulation modeling and experimental verification is used to investigate the dynamic characteristics and thermal management performance of the new device under different working conditions. The experimental results show that compared with the traditional silicon-based devices, the switching loss of the new power electronic devices is reduced by 40%, and the overall efficiency of the system is improved by 5-8%. At the same time, by optimizing the drive circuit design and the electromagnetic compatibility processing, the electromagnetic interference problem caused by the high frequency switch is effectively solved.

Keyword: wide bandgap semiconductor  motor drive system  power electronic device



目    录
1绪论 1
1.1研究背景 1
1.2研究现状 1
1.3本文研究方法与创新点 2
2新型电力电子器件的特性分析 2
2.1宽禁带半导体器件的性能优势 2
2.2碳化硅器件在电机驱动中的应用特性 2
2.3氮化镓器件的开关特性研究 3
3高效电机驱动系统的拓扑结构优化 3
3.1基于新型器件的逆变器拓扑设计 4
3.2PWM控制策略的优化与实现 4
3.3系统效率提升的关键技术分析 5
3.4 EM抑制与热管理方案设计 5
4新型电力电子器件的应用验证与评估 6
4.1实验平台搭建与测试方法 6
4.2系统效率与动态性能测试结果分析 6
4.3可靠性评估与寿命预测模型构建 7
5结论 8
参考文献 9
致谢 10

 
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